The used F&K Delvotec M17LSB Ultrasonic Laser Bonder is a high-precision wire bonding system designed for advanced microelectronic and semiconductor manufacturing applications. Combining ultrasonic and laser bonding capabilities, the M17LSB delivers consistent, high-strength bonds with precise control, making it ideal for high-reliability and high-density packaging environments. This model is known for its flexible bonding options, user-friendly interface, and robust engineering, offering dependable performance in demanding production settings.
| Dimensions | 80x77x82 (GENERAL) | 80x77x82 (GENERAL) |
| Weight | 999 (FREIGHT) | 999 (FREIGHT) |
Unit 80x77x82
Controls 50x31x80
