The F & K Delvotec M17LSB Ultrasonic Laserbonder is a used hybrid bonding system that integrates ultrasonic and laser bonding technologies to deliver high-precision connections for microelectronics, battery, and semiconductor applications. This unit is functional but includes a damaged key switch, which may require replacement for full operational readiness. With flexible laser wavelength options, microsecond-level energy control, and a large bonding workspace, the M17LSB is ideal for fine-pitch, high-density, and complex geometries. Designed with automation in mind, it features advanced calibration tools and vision systems to support high-throughput environments.
| Dimensions | 80x77x82 (GENERAL) | 80x77x82 (GENERAL) |
| Weight | 999 (FREIGHT) | 999 (FREIGHT) |
Unit 80x77x82 (GENERAL)
Controls 50x31x80
