The F & K Delvotec M17LSB Ultrasonic Laserbonder is a used advanced wire bonding and micro-welding system, tailored for high-precision electronic and power module manufacturing. Designed to handle a wide range of materials and bonding applications, this hybrid ultrasonic and laser bonding platform combines the precision of laser welding with the adaptability of ultrasonic techniques. Featuring customizable laser wavelengths, microsecond pulse control, and a generous work envelope, the M17LSB supports fine-pitch bonding, battery tab welding, and other high-density interconnect applications with reliable speed and accuracy.
| Dimensions | 80x77x82 (GENERAL) | 80x77x82 (GENERAL) |
| Weight | 999 (FREIGHT) | 999 (FREIGHT) |
Unit 80x77x82 (GENERAL)
Controls 50x31x80
